• Dual usage SOIC-32 (0.050” pin pitch) or SSOP-32 (0.65mm pin pitch) adapter.
• Two 1x16 headers provided (not soldered).
• DIP-32 rows are 0.6” apart. DIP-32 holes are drilled on 0.1" (2.54mm) centers. 0.037" (0.94mm) holes sized for square post headers.
• Etched FR4 glass-epoxy circuit board. Solder mask to prevent solder bridges.
• Double-sided, 1oz/ft2 copper, anti-tarnish coating for easy soldering. Lead free and RoHS compatible.
• Size = 0.700 x 1.600in, 1/16" thick (1.6mm).

This AdapterBoard connect SOIC or SSOP integrated circuits to DIP-32 pins to allow them to be used with solderless breadboards or thru-hole prototyping boards.

Dual-usage adapter. The board has a SOIC-32 footprint on the top (0.050” pin pitch) and a SSOP-32 (0.65mm pin pitch) footprint on the bottom. The SOIC pads can be used for narrow or wide packages (up to 0.500” pin-to-pin). Multiple smaller SOICs can be installed.

Bonus SMT pads allow other components to be added on square 0.050” pads. Vias allow connection to SMT pads on other side. Tracks under SOIC-32 connect left and right SMT pads to carry signals. These can be used to add decoupling capacitors to the IC when the power and ground pins are at opposite ends.