This is more common than you might expect, and there are a few likely causes:

Cold or bridged solder joints. Inspect every joint under magnification. A good joint is smooth and shiny, and wets the pad fully. A cold joint looks dull or cracked. A solder bridge is a small blob connecting two adjacent pads. Both cause intermittent or hard faults.

Wrong component orientation. Diodes, electrolytic capacitors, transistors, and ICs are all polarity-sensitive. Double-check that each one is oriented correctly against your schematic.

These are all prototyping platforms, each suited to a different stage of development or type of project.

Solderless BreadBoard (e.g., BPS BB830): No soldering required. Components and wires are inserted into spring contacts. Fully reusable. Best for experimenting, testing circuit ideas, and learning. Connections are temporary and can be removed for troubleshooting or new projects.