BB3U BusBoard-3U, Zig-zag Busses, Soldermask, Accepts DIN Conn

  • Reduces cut traces and jumper wires to speed prototype assembly.
  • The zig-zag pattern can be used to to connect DIP IC’s and DIL headers pin-to-pin.
  • Etched high-quality FR4 glass-epoxy circuit board with solder mask to prevent solder bridges.
  • Single-sided, 1oz/ft2 copper, anti-tarnish coating for easy soldering.
  • 38 x 62 holes, 76 separate BusBoard traces, 0.037" holes are drilled on 0.1" (2.54mm) centers.
  • Standard single height (3U) Eurocard/VME size: 3.9" wide, 6.3" long, 1/16" thick (100 x 160 x 1.6mm).
The BusBoard-3U prototyping circuit board has the BusBoard zig-zag circuit pattern. It is useful for connecting headers and DIP ICs pin-to-pin without cutting tracks or adding wires. It’s great for 2-row parts with many common signals such as memory buses or power and ground connections for ICs. Opposite sides of the IC or connector are on separate tracks to simplify wiring. Wide and narrow tracks and locator holes identify which pads are connected. The solder mask helps avoid shorts when soldering. The PCB accepts a 96 pin DIN-41612 VME connector for backplane or board-to-board applications with.Holes for ejector latches are provided.